High Density Interconnects Handle Vibrations and Shocks
A wide array of electronic devices are susceptible to vibration and shock. From pagers and palm-top organizers to compactly designed cell phones, these gadgets can easily be damaged by mechanical shock or vibration that can lead to component failure, poor performance, or even complete system shutdown. The good news is that electronic device manufacturers are aware of these issues and are implementing various measures to prevent them.
One of the most effective ways to handle vibration and shock is by using high density interconnects. This is a printed circuit board technology that helps reduce the size of an electronic product by eliminating unnecessary components and connecting different layers of the PCB with the help of small conductive holes known as vias. Vias allow signals to move from one layer to another, and they have a diameter of less than 0.006 inches.
high density interconnect PCBs are used in a number of applications including mobile/cellular phones, touch-screen devices, laptop computers, digital cameras, 4/5G network communications, and military applications such as avionics and smart weapons. Their compact shape keeps them from breaking down quickly or being damaged by environmental conditions or physical impacts. They are also employed in industrial automation, as they relay information to other connected devices and equipment in manufacturing, warehousing, and other business settings.
How Do High Density Interconnects Handle Vibrations and Shocks?
The design and construction of HDI PCBs requires meticulous attention to detail in order to ensure proper functioning. In addition, these devices undergo all-inclusive testing in order to guarantee full functionality and enhanced quality standards. Testing involves gauging parameters, such as signal integrity and current consumption, in order to identify any possible issues that may arise in the future.
Despite the rigorous manufacturing and testing processes that HDI PCBs undergo, they are still vulnerable to environmental conditions such as vibration and shock. For this reason, it is important that all electronic device manufacturers incorporate vibration and shock-resistant features into their products.
For example, electronic component manufacturers should use the highest grade copper available to ensure optimal thermal security and resistance in harsh operating environments. This will help prevent thermal stress, which can compromise the operational effectiveness of a device. In addition, they should utilize progressive technologies to design and construct the PCBs. These technologies can include a plating-thru-hole process for blind and buried vias, as well as inkjet printing that incorporates silver nanoparticles.
Sophisticated materials and progressive technologies can help to ensure first-rate product excellence for all electronic devices, including those that will be deployed in vibration and shock-prone environments. These features should be carefully designed and incorporated into the prototypes of these devices to prevent premature product failure due to unanticipated environmental stress factors. Additionally, manufacturers should ensure that all unused wires are dead-ended and tied into a bundle, and that the excess strands are coiled up or stowed away to prevent them from becoming exposed and potentially damaging other components or equipment.